×
×

Products

AM-640L

Automatic thinning film machine

This equipment utilizes a screw rod guide mechanism, touch screen, and PLC modular software control to achieve automatic film stretching, film application, film cutting, and other actions, for applying film to wafers before thinning.

online consultation

Tel：

400-0057-577
Product Introduction Machine Feature Specification

Product Introduction

This equipment utilizes a screw rod guide mechanism, touch screen, and PLC modular software control to achieve automatic film stretching, film application, film cutting, and other actions, for applying film to wafers before thinning.

Machine Feature

  • Utilize Kinco touch screen for parameter settings of the equipment
  • Equipped with soft anti-static rollers, the film pressure can be linearly adjusted
  • The vacuum chuck is treated with Teflon, and its height can adapt to different wafer thicknesses, effectively protecting the wafers

Specification

Wafer Size ∅200mm (8″), ∅300mm(12″)
Wafer Thickness 600μm～1000μm
Standard Film Width 12 inch is 330mm、8 inch is 230mm
Film Application Method Automatic roller-type
Batch Production Capacity 12 inch: 40 wafers per hour or more; 8 inch: 50 wafers per hour or more (under skilled operation)
Power Supply AC220V Single Phase 50Hz Power 1200W
Compressed Air 0.5～0.6 MPa（Clean, free from impurities）
Equipment Dimensions 620 × 1080 × 550（mm） Excluding the height of the three-color indicator light.
Weight Approximately 160 Kg
To product list

  • 12-inch dual-spindle fully-automatic dicer

    8230

    • Contact Us

    Please leave your industry needs and we will be happy to help you

    Why choose us？

    • Industry accumulation and succession

    • Core components · Autonomous control

    • Local research and development · Accumulate steadily

    develop a proposal 400-0057-577

    Related Product