8230 is a fully automatic dual spindle 12-inch dicing saw with high precision and performance. Its opposed distribution design, coupled with a newly developed operating system, offers an efficient and cost-effective cutting experience.
· Spindle: exclusively tailored with optimized design; high-speed operation with ultra-low vibration
· Grinding wheel cover structure: cutting area, standard with high cleanliness type nozzl
· BBD: newly upgraded algorithm for more stable detection
· Microscope: faster scratch inspection speed; higher precision straightening results
· Non contact height measurement unit: dual non-contact height measurement unit for higher efficiency; Anti pollution lid design reduces maintenance frequency
8220 is a fully automatic dual spindle 8-inch dicing saw with high precision and performance. Its opposed distribution design, coupled with a newly developed operating system, offers an efficient and cost-effective cutting experience.
· Spindle: exclusively tailored with optimized design; high-speed operation with ultra-low vibration
· Grinding wheel cover structure: cutting area, standard with high cleanliness type nozzl
· BBD: newly upgraded algorithm for more stable detection
· Microscope: faster scratch inspection speed; higher precision straightening results
· Non contact height measurement unit: dual non-contact height measurement unit for higher efficiency; Anti pollution lid design reduces maintenance frequency
6231 is a dual spindle dicing saw with high precision and high efficiency. It can dice product up to 12″ in diameter and has the smallest footprint among similar machines.
· Automatic image recognition
· Multiple alignment modes for various needs
· Utilized least squares algorithm to ensure alignment of linear arc products
· Supports fully automatic alignment for multi-piece positioning
· Supports independent setting of cutting sequence
6110 is a high accuracy and high performance automatic machine with single spindle. The footprint is extremely small. 6110 provides efficient and low cost cutting experience with a newly designed operating system.
· The standard configuration is a 2.2kW high speed spindle (torque: 0.42N · m, maximum rotation speed: 60,000rpm)
· Equipped with a 17-inch large-screen LCD touchscreen, featuring a user-friendly operating interface
· The θ axis has the high rotation accuracy and rotation resolution driven by a DD motor
· Fragment shape recognition feature
· It is a highly practical equipment capable of precision cutting of silicon wafers, PCB boards, ceramics, and other materials. The equipment has a small footprint, which helps to save operating costs
Loadpoint, one of subsidiary companies of GLTECH, is the inventor of the semiconductor dicer globally. ADT, another subsidiary company, inherits 40 years of experience from Kulicke & Soffa in R&D, production, perception and creativity for the industry.
The air bearing spindle produced by LPB is widely used in the industry. ADT is one of the only two companies in the world which possess both dicer and air bearing spindle technologies. ADT Blade technology is in the leading position in the industry.
Technology driven has become a corporate gene of the company, which yearly input over 10% of revenue into R&D. The domestic team, following the spirit of “Living Innovation”, has accomplished localization and the products have reached the quality of top level in the industry.
Behind the brand of “ADT”, there are supports from core parts production base of LP/LPB in U.K., production line in Haifa Israel and HQ in Zhengzhou, China. Three bases cooperate and ensure production and quality.
Self-reliance core parts, reliable circuits provided by SMT workshop, precisely produced casting, all these turn into products of high quality. Also, local products inherits the experience and reliability of 30 years in the industry of IOT sensor components and equipment production.
New semiconductor equipment production base, which is of 178 acres in Zhengzhou Airport District, will soon been put into use. It will provide a space of 50,000m2 for producing and testing of the semiconductor equipment and ensure a capacity of year 500sets dicing equipment production.
GLTECH, Listed on the Shenzhen Stock Exchange in 2015, is a China-based International high-tech company. We insist the management perception of “Living Innovation”, and devoted ourselves into possessing core technology of producing semiconductor equipment and Industrial Intelligence equipment worldwide.
Entering GL TechIn 2019, led by GLTECH, ADT was acquired by the Chinese capital and merged its business into GLTECH semiconductor producing and selling business.
We have standard clean room where we can performance test cutting and provide customized solution to our customers. They can also experience the process on site.
Knowledge, judgement and experience support the application of dicing semiconductor products. Suitable equipment, specific blade and proper application setting and process control are the keys to success.
We preserve sufficient inventory for accessory of the equipment to ensure delivery. All accessory are in accordance with the those equipped on the machines. Installation and testing are provided when changing these accessories at customer side.
GLTECH & ADT wish you a very happy Spring Festival!
In China, the term “New Spring” refers to the Chinese New Year, also known as the Spring Festival. The Spring Festival is the most important traditional festival for the Chinese people. With a long history, the Spring Festival evolved from the ancient tradition of praying for a good harvest and offering sacrifices to ancestors at the beginning of the year. The origin of the Spring Festival contains profound cultural connotations and has carried rich historical and cultural heritage in its development and inheritance.
The Chinese semiconductor industry is currently in a golden period of development and growth, with domestic equipment manufacturers increasing their investment to contribute to the “Chinese chip” initiative.
From March 20th to 22nd, the Shanghai New International Expo Center.
SEMI China Semiconductor Supply Chain International Forum Event
From March 20th to 22nd, the Shanghai New International Expo Center.
SEMI China Semiconductor Supply Chain International Forum Event
GL Tech Official Douyin Account
GL Tech Official WeChat Account
