8030

12-inch dual-spindle fully automatic dicer

12" Silicon wafer dicing supporting 6" and 8" wafers plus Large QFN multi panels

The equipment has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users
The preferred model for domestic replacement of semiconductor wafer cutting equipment in the top 10 semiconductor packaging and testing factories
The core components of the entire machine are independently controllable and are not affected by global economic and political changes

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Product Introduction Machine Feature Specification

12″ Silicon wafer dicing supporting 6″ and 8″ wafers plus Large QFN multi panels

Workpiece Size		∅8″,∅12” or 12″x12″ Square
Spindle		Two facing 1.8 kW or 2.2 kW, max. 60,000 rpm
Blade Size		2″~3″
Y1/ Y2 Axis	Control	Linear encoder for each Y axis
	Resolution	0.1 μm
	Cumulative Accuracy	1.5 μm
	Indexing Accuracy	1.0 μm
	Cutting range	350 mm
X Axis		Air Slide
Z1/Z2 Axis	Resolution	0.2 μm
	Repeatability	1.0 μm
	Max. Stroke	50 mm (for 2.188” blade OD)
θ Axis	Repeatability	4 arc-sec
θ Axis	Stroke	380°
Cleaning Station		Full rinse and dry cycle
	Spinning speed	100~3,000 rpm
	Cleaning Method	Atomized Cleaning Capabilities
Utilities	Electrical	200-240VAC，50-60Hz，single phase
Dimension	(W x D x H) mm	1145 × 1687×1830
Dimension	Weight	1500 kg

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