×
×

Products

8230

12-inch dual-spindle fully-automatic dicer

8230 is a fully automatic dual spindle 12-inch dicing saw with high precision and performance. Its opposed distribution design, coupled with a newly developed operating system, offers an efficient and cost-effective cutting experience.

  • The dicer has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users
  • The preferred model for domestic replacement of semiconductor wafer cutting equipment in the top 10 semiconductor packaging and testing factories
  • The core components of the entire machine are independently controllable and are not affected by global economic and political changes
PDF

Product Introduction

8230 is a fully automatic dual spindle 12-inch dicing saw with high precision and performance. Its opposed distribution design, coupled with a newly developed operating system, offers an efficient and cost-effective cutting experience.

 

· Spindles of 1.8 kW or 2.2 kW high power( for challenging applications )

· lntuitive operation interface using a large 17″ touch screen monitor

Machine Feature

  • Spindle: exclusively tailored with optimized design; high-speed operation with ultra-low vibration.
  • Grinding wheel cover structure: cutting area equipped with a super clean nozzle for cleaning.
  • BBD: upgraded algorithm for more stable detection.
  • Microscope: faster scratch inspection speed; higher precision straightening results.
  • Non-contact height measurement unit: equipped with dual non-contact height measurement units, providing higher efficiency; pollution-proof cover design reduces maintenance frequency.

Software Function

  • New GUI interface
  • Automatic positioning
  • Automatic scratch detection. The detection items include: distance from the center of the scratch to the target position, scratch width, maximum scratch width, width from the center of the scratch to the edge, maximum burr width, and burr size.
  • Follow-up keyboard design with automatic filtering and search function during the input process.
  • Picture-in-picture function for real-time zooming of the central screen during operation, significantly improving operation accuracy.

Specification

Maximum Workpiece Size    ø300 mm
X-axis Cutting Range 310mm
Feed Rate Input Range 0.1-800mm/s
Y1/Y2-axis Cutting Range 310 mm
Single Step (Resolution) 0.1 μm
Cumulative Accuracy ≤3μm/310 mm
Indexing Accuracy ≤2μm/5mm
Z1/Z2-axis Maximum Stroke 30mm(Corresponding to 2-inch blades)
Movement Resolution 0.1 μm
Repeatability Accuracy 1.0 μm
θ-axis Maximum Rotation Angle 380°
Spindle Spindle Type Face to Face Dual Spindle
Rated Torque 0.33 N · m(1.8 kW)
Maximum Rotational Speed 60000 rpm
Blade Size   2″
Cleaning Station Rotation Speed 100-2000 rpm
Cleaning Method Standard Spec Atomized / Option Spec High   Pressure
Facilities Electrical 380VAC,50 / 60 Hz,three-phase
Air ≥500 L/min
Spindle Coolant Flow Rate 4L/min(@0.3 Mpa)
Cutting Coolant Flow Rate ≥12 L/min
Dimensions   1220×1550×1850 (mm)
Weight   Approx. 2200 kg
To product list

Please leave your industry needs and we will be happy to help you

Why choose us?

  • Industry accumulation and succession

  • Core components · Autonomous control

  • Local research and development · Accumulate steadily

develop a proposal 400-0057-577

Related Product