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  • Q:  Printed Circuit Board PCB

    Printed Circuit Board (PCB) is a mounting substrate composed of a copper layer and FR4/5 or BT resin. Typical thickness is 0.3 mm -2 mm.

  • Q: Quad Flat Non-leaded Package QFN

    Quad Flat Non-leaded (QFN) packaging is based on a copper wire rack and uses semi packaging technology to expose the back of the grains. The typical grain size is 3x3-10x10 mm, but the current trend is towards smaller and smaller sizes. Mainly divided into three categories: Power QFN: thickness of 1.5-2.5mm (~0.5mm copper wire rack) Standard HE QFN: thickness of 0.8-1.2mm (maximum 0.2mm copper wire rack) Thin QFN: thickness of 0.4-0.6mm (maximum 0.15mm copper wire rack)

  • Q: Ball Grid Array BGA

    Ball Grid Array uses epoxy resin (FR4/5) or BT resin as the substrate, and uses wire-bonded or flip-chipped to connect the grains to the substrate. The back of the grain is usually encapsulated in epoxy resin, without pins, and connected to the PCB through a Solder Ball Array. The typical thickness is 0.9-2.0 mm (including solder balls). The common packaging dimensions are 4x4-20x20 mm.

  • Q:Surface Acoustic Wave Element SAW

    Surface Acoustic Wave Element (SAW) uses piezoelectric materials to convert sound waves (i.e. Mechanical wave) into electromagnetic signals or electromagnetic signals into sound waves. At present, the common Surface Acoustic Wave Element is the SAW Band-pass Filter (SAW BPF), which sorts the signals according to the frequency. The widely used matrix is brittle material, such as Quartz (SiO2), Lithium niobate (LiNbO3) and Lithium tantalate (LiTaO3).

  • Q: Piezoelectric Ceramic Transduce PZT

    It is a ceramic material with piezoelectric properties (which generates charges due to deformation/pressure). A common application is ultrasound imaging in the medical industry. In most applications, PZT is vertically cut to form a series of shallow incisions.

  • Q: Low Temperature Co Fired Ceramic LTCC

    Low Temperature Co Fired Ceramic (LTCC) substrate is made by overlaying refractory film tape with printed wires and using a co firing process. The product has low dielectric constant and dielectric loss, and can embed multi-layer components in multi-layer structures.

  • Q:  Multi-layer Ceramic Capacitors MLCC

    Green ceramic, a basic capacitor, consists of two conductive electrodes separated by insulating dielectric materials. Multi-layer Ceramic Capacitors consists of a large number of parallel electrodes between thin layers of high capacitance ceramic materials.

  • Q: Ceramic Al2O3

    A ceramic material composed of alumina, with a typical concentration of 96-99.6%. Its hardness increases with the increase of alumina concentration, with high resistance and thermal resistance, high mechanical strength, good electrical characteristics, and low dielectric loss at high frequencies. The typical thickness is 0.1-5.0 mm.

  • Q: Application of LED Gallium Arsenide

    Gallium Arsenide (GaAs) is a direct bandgap semiconductor material that can emit light, making it commonly used in the LED industry. Gallium arsenide has high-speed performance and is very suitable for radio frequency devices such as mobile phones, as well as microwave devices used for military purposes such as radar and intelligent weapons. Due to its high content of arsenic, it poses certain risks.

  • Q: Glass

    Silicon dioxide, in its amorphous form, with or without modification, is a hard, brittle, and transparent material that can be used as a substrate for various applications. Specific types include quartz glass, borosilicate glass, and alkali free glass. Typical thickness is 0.3-5 mm, with or without protective coating and optical coating.