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AM-620L

Automatic film cutting machine

This device adopts a screw rod guide mechanism, touch screen, and PLC modular software control to achieve automatic film stretching, film application, film cutting, and other actions, to apply film to wafers before cutting.

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400-0057-577
Product Introduction Machine Feature Specification

Product Introduction

This device adopts a screw rod guide mechanism, touch screen, and PLC modular software control to achieve automatic film stretching, film application, film cutting, and other actions, to apply film to wafers before cutting.

Machine Feature

  • Utilize Kinco touch screen for parameter settings of the equipment
  • Equipped with soft anti-static rollers, the film pressure can be linearly adjusted
  • The vacuum chuck is treated with Teflon, and its height can adapt to different wafer thicknesses, effectively protecting the wafers

Specification

Wafer Size ∅200mm (8″), ∅300mm(12″)
Wafer Thickness 350μm～750μm
Standard Film Width 12 inch is 400 mm, 8 inch is 300 mm
Film Application Method Automatic roller-type
Batch Production Capacity 12 inch: 40 wafers per hour or more; 8 inch: 50 wafers per hour or more (under skilled operation)
Power Supply AC220V Single Phase 50Hz Power 1200W
Compressed Air 0.5～0.6 MPa（Clean, free from impurities）
Equipment Dimensions 620 × 1080 × 550（mm） Excluding the height of the three-color indicator light.
Weight Approximately 160 Kg
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