01 Strategic Cooperation

On April 28, 2025, GL Tech Ruihong Electronic Technology Co., Ltd. (ADT), a wholly-owned subsidiary under GL Tech's semiconductor equipment division, and Ruijie Micro Technology (Zhengzhou) Co., Ltd. (RMT) held a grand signing ceremony for a strategic cooperation agreement in Zhengzhou.

Both parties will carry out in-depth cooperation in the field of advanced packaging grinding and cutting, jointly building a collaborative innovation alliance framework centered on "demand-driven orientation, technological breakthrough, and industrial validation," and creating a domestically developed, fully automated advanced packaging R&D and production platform integrating "material characterization – equipment optimization – process verification – application closed-loop." This collaboration marks a substantial step forward in overcoming technological bottlenecks through collaborative innovation among enterprises across the upstream and downstream of China's advanced packaging industry chain.

02 Tech Upgrade: Jointly Crafting a New Industrial Blueprint

Tony Zhao, Chairman of GL Tech, led his delegation to conduct an in-depth inspection of Ruijie Micro's Zhengzhou production base, accompanied by Fang Jia'en, Chairman of Ruijie Micro; the Dean of its Research Institute; and the core team. They specifically visited the fully automated production lines for wire-bonding SiP packaging, flip-chip bonding FCCSP/FCBGA/FCMCM, advanced packaging New Product Introduction (NPI) lines, as well as the automated production management systems integrated with MES/ERP/EAP/PMS. Subsequently, both parties held in-depth discussions on topics including the application of advanced packaging technology, development of core processes, domestic substitution of equipment and materials, and one-stop design simulation services.

During the achievement demonstration session, Ruijie Micro highlighted its innovative product portfolio, including: automotive-grade wire bonding (WB) packaging products, high-reliability Flip Chip Chip Scale Package (FCCSP) products, large-size Flip Chip Ball Grid Array (FCBGA) packaging products with excellent heat dissipation performance, multi-chip integration Multi-Chip Module (MCM)/System in Package (SiP) packaging products, as well as 2.5D and bridging advanced packaging reconstituted wafers and packaged products. These achievements fully demonstrate Ruijie Micro's profound technical accumulation and forward-looking R&D layout in the field of advanced packaging.

Mr. Fang Jia'en, Chairman of Ruijie Micro, and his delegation also conducted an in-depth inspection of GL Tech's R&D and manufacturing production lines for advanced grinding and cutting equipment. GL Tech showcased its capabilities, including: engineering technical expertise built on ADT's over 40 years of global experience; core component development capabilities inherited from U.K.-based LP & LPB; and refined management and lean manufacturing capabilities supported by its listed company platform. The delegation learned about the localized deployment of GL Tech's Chinese team in these fields, as well as practical applications of grinding and cutting technologies in advanced packaging, laying the foundation for the implementation of this cooperation between the two parties.

03 Industrial Integration: Breaking Through Industry Pain Points

At the symposium, Chairman Fang Jia'en systematically elaborated on the development vision and long-term plan for the advanced packaging industry, proposing to jointly build a collaborative innovation R&D platform by integrating the core strengths and resources of both parties. Chairman Tony Zhao fully concurred with this proposal and provided a detailed introduction to GL Tech's continuous investment in and innovative achievements in the field of advanced packaging equipment, particularly highlighting key technological breakthroughs in grinding and cutting process packaging equipment, which have effectively addressed common industry challenges. The two parties will join hands to create customized comprehensive solutions tailored for advanced packaging.