Related Products

• 8230

  12-inch dual-spindle fully-automatic dicer

  8230 is a fully automatic dual spindle 12-inch dicing saw with high precision and performance. Its opposed distribution design, coupled with a newly developed operating system, offers an efficient and cost-effective cutting experience.
  

  Machine Features:

  · Spindle: exclusively tailored with optimized design; high-speed operation with ultra-low vibration

  · Grinding wheel cover structure: cutting area, standard with high cleanliness type nozzl

  · BBD: newly upgraded algorithm for more stable detection

  · Microscope: faster scratch inspection speed; higher precision straightening results

  · Non contact height measurement unit: dual non-contact height measurement unit for higher efficiency; Anti pollution lid design reduces maintenance frequency

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• 6110

  6-inch single spindle automatic dicer

  6110 is a high accuracy and high performance automatic machine with single spindle. The footprint is extremely small. 6110 provides efficient and low cost cutting experience with a newly designed operating system.

  Machine features:

  · The standard configuration is a 2.2kW high speed spindle (torque: 0.42N · m, maximum rotation speed: 60,000rpm)

  · Equipped with a 17-inch large-screen LCD touchscreen, featuring a user-friendly operating interface

  · The θ axis has the high rotation accuracy and rotation resolution driven by a DD motor

  · Fragment shape recognition feature

  · It is a highly practical equipment capable of precision cutting of silicon wafers, PCB boards, ceramics, and other materials. The equipment has a small footprint, which helps to save operating costs

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• 6231

  12-inch dual-spindle automatic dicer

  6231 is a dual spindle dicing saw with high precision and high efficiency. It can dice product up to 12″ in diameter and has the smallest footprint among similar machines.

   

  Machine Features:

  · Automatic image recognition

  · Multiple alignment modes for various needs

  · Utilized least squares algorithm to ensure alignment of linear arc products

  · Supports fully automatic alignment for multi-piece positioning

  · Supports independent setting of cutting sequence

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• 8030

  12-inch dual-spindle fully automatic dicer

  12″ Silicon wafer dicing supporting 6″ and 8″ wafers plus Large QFN multi panels

  Machine Features:

  · Up to 76.2mm (3”) Blades OD

  · Support up to 12″ X 12″ chuck

  · Ionizer Bar – ESD discharge

  · BARCODE item identification

  · SECS GEM ready

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• 8020

  8-inch dual-spindle fully automatic dicer

  8″ silicon wafer dicing saw or other material such as Glass, SiC and more

  Machine Features:

  · Flexibility – Supports Hub and Hubless blades up to 3” O.D.

  · Spindles of 1.8 kW or 2.2 kW high power

  · Intuitive operation interface using a large 19” touch screen monitor

  · Fast & simple blade change 

  · SECS / GEM platform ready

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