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8020

8-inch dual-spindle fully automatic dicer

8" silicon wafer dicing saw or other material such as Glass, SiC and more

  • The equipment has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users.
  • The preferred model for domestic replacement of semiconductor wafer cutting equipment in the top 10 semiconductor packaging and testing factories.
  • The core components of the entire machine are independently controllable and are not affected by global economic and political changes.
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Product Introduction

8″ silicon wafer dicing saw or other material such as Glass, SiC and more

Machine Feature

  • Flexibility – Supports Hub and Hubless blades up to 3” O.D.
  • Spindles of 1.8 kW or 2.2 kW high power
  • Intuitive operation interface using a large 19” touch screen monitor
  • Fast & simple blade change
  • SECS / GEM platform ready

 

Specification

Workpiece Size ∅8″
Spindle Two facing 1.8 kW or 2.2 kW,

max. 60,000 rpm

Blade Size 2″~3″
Y1/ Y2 Axis Control Linear encoder for each Y axis
Resolution 0.1 μm
Cumulative Accuracy 1.5 μm
Indexing Accuracy 1.0 μm
Cutting range 210 mm
X Axis Air Slide
Z1/Z2 Axis Resolution 0.2 μm
Repeatability 1.0 μm
Max. Stroke 30 mm (for 2.188” blade OD)
θ Axis Repeatability 4 arc-sec
Stroke 380°
Cleaning Station Full rinse and dry cycle
Spinning speed 100-3,000 rpm
Cleaning Method Atomized Cleaning Capabilities
Utilities Electrical 200-240VAC,50-60Hz,single phase
Dimension (W x D x H) mm 1820 × 1460 × 1015
Weight 1300 kg
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Why choose us?

  • Industry accumulation and succession

  • Core components · Autonomous control

  • Local research and development · Accumulate steadily

develop a proposal 400-0057-577

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