Home / 71MD Product Catalog
Industry
8230 is a fully automatic dual spindle 12-inch dicing saw with high precision and performance. Its opposed distribution design, coupled with a newly developed operating system, offers an efficient and cost-effective cutting experience.
· Spindle: exclusively tailored with optimized design; high-speed operation with ultra-low vibration
· Grinding wheel cover structure: cutting area, standard with high cleanliness type nozzl
· BBD: newly upgraded algorithm for more stable detection
· Microscope: faster scratch inspection speed; higher precision straightening results
· Non contact height measurement unit: dual non-contact height measurement unit for higher efficiency; Anti pollution lid design reduces maintenance frequency
6110 is a high accuracy and high performance automatic machine with single spindle. The footprint is extremely small. 6110 provides efficient and low cost cutting experience with a newly designed operating system.
· The standard configuration is a 2.2kW high speed spindle (torque: 0.42N · m, maximum rotation speed: 60,000rpm)
· Equipped with a 17-inch large-screen LCD touchscreen, featuring a user-friendly operating interface
· The θ axis has the high rotation accuracy and rotation resolution driven by a DD motor
· Fragment shape recognition feature
· It is a highly practical equipment capable of precision cutting of silicon wafers, PCB boards, ceramics, and other materials. The equipment has a small footprint, which helps to save operating costs
6231 is a dual spindle dicing saw with high precision and high efficiency. It can dice product up to 12″ in diameter and has the smallest footprint among similar machines.
· Automatic image recognition
· Multiple alignment modes for various needs
· Utilized least squares algorithm to ensure alignment of linear arc products
· Supports fully automatic alignment for multi-piece positioning
· Supports independent setting of cutting sequence
12″ Silicon wafer dicing supporting 6″ and 8″ wafers plus Large QFN multi panels
· Up to 76.2mm (3”) Blades OD
· Support up to 12″ X 12″ chuck
· Ionizer Bar – ESD discharge
· BARCODE item identification
· SECS GEM ready
8″ silicon wafer dicing saw or other material such as Glass, SiC and more
· Flexibility – Supports Hub and Hubless blades up to 3” O.D.
· Spindles of 1.8 kW or 2.2 kW high power
· Intuitive operation interface using a large 19” touch screen monitor
· Fast & simple blade change
· SECS / GEM platform ready
GL Tech Official Douyin Account
GL Tech Official WeChat Account
Support Hotline:
400-0057-577Enterprise mailbox:[email protected]
Company Address:No.10 Changchun Road, Zhengzhou High-tech Industrial Development Zone
Navigate Now