79XX Duo series

8/12-inch dual-spindle automatic dicier

The 79XX Duo series includes three models: 7900, 7920, and 7930. The 7900 is designed for cutting 8-inch silicon wafers and gallium arsenide wafers. The 7920 is suitable for cutting multiple substrates, glass, and saw devices. The 7930 is specifically designed for cutting multiple large substrates and high-efficiency UPH (units per hour) requirements.

• The square chuck types available for selection are 8"×8", 10"×10", and 12"×10"
• The core components of the entire machine are independently controlled and not affected by global economic and political changes
• The air spindle comes with a free 5-year warranty, and software feature development is free for the lifetime