72XX series

8/12-inch single-spindle fully automatic dicer

7222 is used for cutting 8-inch wafers and materials such as PZT and IR glass. 7232 is used for cutting large substrates and multi-layered substrates. 7224 is used for cutting 8-inch thick glass, ceramics, and other hard materials. 7234 is used for cutting 12-inch thick glass, ceramics, and other hard materials. 7302 is an advanced version of 7232 with a larger chuck size of 12"×10". 7304 is an advanced version of 7234 with a larger chuck size of 12"×10".

• Efficient wafer handling system
• Blade wear prediction algorithm to reduce height measurement time and increase hourly output
• The core components of the entire machine are independently controllable and are not affected by global economic and political changes
• Atomized wafer cleaning technology, with excellent process effect.