Products
With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC, Ferrite.
· Various substrates, suitable for various applications
· High-precision cutting
· Reduce wear and increase blade life
· Reduce overall purchase costs (CoO)
· High-precision blade dimensions
With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC, Ferrite.
Blade thickness: 80 – 1500µm
Diamond grit size: 2 – 70 µm
Serrations:
Serrations available for sintered blades as well as various edge shapes
| Diamond grit size (µm) | Product | Material | Matrix |
| 45 up to 55 | BGA , LGA (Tape & Tape-less mounting method) | FR4, Plastic & molding | C2/R5 |
| 30 up to 50 | QFN ( Half Etched) | Cu leadframe + molding | Q7/C1 |
| 35 up to 45 | Passive & Active Devices. Communication Modules | LTCC | P1/P9 |
| 35 up to 45 | SAW Devices, RF Package | HTCC | P1 |
| 13 up to 25 | Camera Module | Glass/ IR Glass | P1/P5 |
| 25 up to 45 | Ceramic Packages | Alumina | P5/P9 |
Industry accumulation and succession
Core components · Autonomous control
Local research and development · Accumulate steadily
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