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Resin Blade

Resin Blade

Soft bond for hard material.
Resin binder enables blade wear management.
Resin-bond Blades are an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic substrates, HTCC and Glass.

· Various combinations, suitable for various applications

· Excellent cutting quality

· High-precision cutting

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Product Introduction

Soft bond for hard material.
Resin binder enables blade wear management.
Resin-bond Blades are an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic substrates, HTCC and Glass.

 

Blade thickness: 75 – 2500µm
Diamond grit size: 3 – 250µm
Available with various edge shapes

Blade Feature

  • Self-sharpening substrate, exposing new diamonds
  • Various combinations, suitable for various applications
  • Excellent cutting quality
  • High-precision cutting
  • The best substrate, suitable for hard, brittle, and composite materials
  • Reduces overall cost (CoO)

Blade Application

Diamond grit size (µm) Product Material Matrix
35 up to 53 Ceramic Packages, Sensors Alumina / AlN C02/C07
53 up to 88 QFN (Half Etched) + Wettable QFN (Full cut) Cu leadframe + molding D02/D07
53 up to 88 QFN (Full Cu) Cu leadframe + molding E01
35 up to 53 DFN (0.3 – 0.5mm) Cu leadframe + molding E31/D02
53 up to 88 Wettable QFN First cut Cu leadframe + molding P07
30 up to 45 SAW Devices, RF Package HTCC QKP/C02
30 up to 53 CCD / Filter / Lens Glass / Quartz QKP/E33
45 up to 63 Optical & Electro Optical Components Sapphire QKP
30 up to 53 Passive & Active Devices. Communication Modules LTCC QKP

Resin Blades Part Number Description

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