Products
Soft bond for hard material.
Resin binder enables blade wear management.
Resin-bond Blades are an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic substrates, HTCC and Glass.
· Various combinations, suitable for various applications
· Excellent cutting quality
· High-precision cutting
Soft bond for hard material.
Resin binder enables blade wear management.
Resin-bond Blades are an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic substrates, HTCC and Glass.
Blade thickness: 75 – 2500µm
Diamond grit size: 3 – 250µm
Available with various edge shapes
| Diamond grit size (µm) | Product | Material | Matrix |
| 35 up to 53 | Ceramic Packages, Sensors | Alumina / AlN | C02/C07 |
| 53 up to 88 | QFN (Half Etched) + Wettable QFN (Full cut) | Cu leadframe + molding | D02/D07 |
| 53 up to 88 | QFN (Full Cu) | Cu leadframe + molding | E01 |
| 35 up to 53 | DFN (0.3 – 0.5mm) | Cu leadframe + molding | E31/D02 |
| 53 up to 88 | Wettable QFN First cut | Cu leadframe + molding | P07 |
| 30 up to 45 | SAW Devices, RF Package | HTCC | QKP/C02 |
| 30 up to 53 | CCD / Filter / Lens | Glass / Quartz | QKP/E33 |
| 45 up to 63 | Optical & Electro Optical Components | Sapphire | QKP |
| 30 up to 53 | Passive & Active Devices. Communication Modules | LTCC | QKP |
Industry accumulation and succession
Core components · Autonomous control
Local research and development · Accumulate steadily
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