Products
Hub Blade
A perfect solution for the optimization of the dicing process for various types of materials such as: Silicon, GaAs and other wafers.
Our hub blades provide:
· Improved cut quality
· Longer blade life
· Higher UPH
A perfect solution for the optimization of the dicing process for various types of materials such as: Silicon, GaAs and other wafers.
Industry accumulation and succession
Core components · Autonomous control
Local research and development · Accumulate steadily
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